Review of Various Curing Processes and Techniques of Printed Circuit Board (PCB) and Introduction of New Innovative Thermal Curing Technique

Abstract

This paper examines the history of curing methods of Printed Circuit Boards (PCBs), especially, the thermal-based curing method with its different curing process techniques. In addition, highlighting its importance, hence, an incomplete curing process can lead to delamination, cracking, or other failures, which render the PCB useless. Moreover, various techniques used in the thermal-based curing method with their advantages will be explained. Also, the limitations of each technique will be demonstrated, such as, long curing times, uneven temperature distribution, high energy consumption, and absence of the knowledge-base of different PCBs, like board volume, heating capacity, and electronic elements. Furthermore, factors that affect the thermal-based curing method like type of material used, humidity, temperature, and time duration will be presented. So, each factor must be carefully controlled to ensure that the curing process is effective and consistent. In addition, a new innovative thermal-based curing approach will be introduced to overcome these limitations by using Artificial Intelligence (AI) techniques for the indirect prediction of temperature on PCBs. The proposed approach involves the use of new proper control based on AI technique to obtain an advanced control technique to control the heating process of PCBs during the curing process. This new approach will be developed during an ongoing research and development project.